Mass production ultrasonic dicing equipment: Ultrasonic cutting device CSX501
Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!
The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.
- Company：日精 本社
- Price：10 million yen-50 million yen
